Author:
Park Seungbae,Dhakal Ramji,Lehman Lawrence,Cotts Eric
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference14 articles.
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3. Park SB, Dhakal R, Lehman LP, Cotts EJ. Grain formation and intergrain stresses in a Sn–Ag–Cu solder ball. In: Proceedings of ASME InterPACK, San Francisco, CA, 2005.
4. Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy;Matin;Scripta Mater,2005
5. Elastic constants of β tin from 4.2K to 300K;Rayne;Phys Rev,1990
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