Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference19 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging
3. Solid-state intermetallic compound layer growth between copper and 95.5Sn-3.9Ag-0.6Cu solder
4. M. Oh, Doctoral Thesis, Lehigh University, 1994.
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