Roles of phosphorous in Sn4Ag0.5Cu solder reaction with electrolytic Ni–Au
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference31 articles.
1. Lead-free Solders in Microelectronics
2. Physics and materials challenges for lead-free solders
3. Interfacial reactions between lead-free solders and common base materials
4. A study of nanoparticles in Sn–Ag based lead free solders
5. Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications
Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Thermodynamic Reassessment of the Binary Cu-Sn, Cu-P, and Sn-P and Ternary Cu-Sn-P Systems;Journal of Phase Equilibria and Diffusion;2024-05-14
2. Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders;Journal of Electronic Materials;2023-04-27
3. Progress on microstructure features and creep properties of prospective Tin-Silver-Zinc alloy using a magnetic field;Materials Research Express;2021-08-01
4. Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field;Microelectronics Reliability;2020-10
5. Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints;Applied Surface Science;2020-02
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