Interfacial reaction, ball shear strength and fracture surface analysis of lead-free solder joints prepared using cobalt nanoparticle doped flux
Author:
Funder
High Impact Research
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference42 articles.
1. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications;Anderson;J. Mater. Sci. Mater. El.,2007
2. High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications;Shnawah;J. Electron. Mater.,2012
3. Effects of temperature and strain rate on the mechanical properties of lead-free solders;Ma;J. Electron. Mater.,2010
4. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8 Ag–0.7 Cu lead-free solder and copper substrate;Tay;Intermetallics,2013
5. Effects of Co nanoparticle addition to Sn–3.8 Ag–0.7 Cu solder on interfacial structure after reflow and ageing;Haseeb;Intermetallics,2011
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2. Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles;Journal of Materials Science: Materials in Electronics;2023-12
3. Effects of Cu and In on the microstructure evolution and mechanical properties of Sn-20Bi/Cu solder joints;Journal of Materials Science: Materials in Electronics;2023-02
4. Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix;Journal of Materials Science: Materials in Electronics;2022-08-25
5. Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration;Journal of Materials Science: Materials in Electronics;2022-05-31
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