Control of Ni–Sn interfacial reactions through reactant design
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
1. Investigations of an Electrodeposited Tin‐Nickel Alloy: I . Thermal Stability by Differential Thermal Analysis and X‐Ray Diffraction
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1. Study on the Kinetics of Ni3Sn4 Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process;Metallurgical and Materials Transactions A;2022-02-27
2. Wet-Chemical Synthesis of DO19 Type Intermetallic Compounds: The Case for Ni3Sn Nanoparticles;Journal of Electronic Materials;2019-09-19
3. Detailed Characterization of the Surface and Growth Mechanism of Monodisperse Ni3Sn4 Nanoparticles;ACS Omega;2018-12-10
4. Surface and transport properties of liquid Ag–Sn alloys and a case study of Ag–Sn eutectic solder;Journal of Materials Science: Materials in Electronics;2018-08-22
5. Wetting and interfacial reactions: Experimental study of the Sb-Sn-X (X = Cu, Ni) systems;Journal of Mining and Metallurgy, Section B: Metallurgy;2018
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