Phase diagrams for lead-free solder alloys-Reference-Cited by-同舟云学术

Phase diagrams for lead-free solder alloys

Published:2002-12 Issue:12 Volume:54 Page:45-51
ISSN:1047-4838
Container-title:JOM
language:en
Short-container-title:JOM

Author:

Kattner Ursula R.

Publisher

Springer Science and Business Media LLC

Subject

General Engineering,General Materials Science

Link

http://link.springer.com/content/pdf/10.1007/BF02709189.pdf

Reference46 articles.

1. F.W. Gayle et al.,JOM, 53 (6) (2001), pp. 17–21.

2. U.R. Kattner,JOM, 49 (12) (1997), pp. 14–19.

3. N. Saunders and A.P. Miodownik,CALPHAD (Calculation of Phase Diagrams): A Comprehensive Guide (New York: Elsevier Science, 1998).

4. B.-J. Lee and H.M. Lee,Design and Reliability of Solder and Solder Interconnections, eds. R.K. Mahidhara et al. (Warrendale, PA: TMS, 1991), pp. 129–136.

5. I. Ohnuma et al.,J. Electron. Mater., 28 (1999), pp. 1164–1171.

Cited by 82 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of Ag content on microstructure evolution, intermetallic compound (IMC) and mechanical behaviour of SAC solder joints;Microelectronics Reliability;2023-08

2. Phase-separated bimetal enhanced sodium storage: Dimer-like Sn-Bi@C heterostructures with high capacity and long cycle life;Journal of Energy Chemistry;2023-04

3. Microstructure characterization of (Sn1−Zn )57(In0.78Bi0.22)43 low melting point lead-free solder materials;Transactions of Nonferrous Metals Society of China;2023-01

4. Cu-Ni-Sn Ternary Phase Diagram Evaluation;MSI Eureka;2022-04-27

5. Kinetics and thermodynamics of compound growth due to reactive diffusion between solid Cu and binary Bi-Sn alloys;Journal of Molecular Liquids;2022-02