An ordered structure of Cu3Sn in Cu–Sn alloy investigated by transmission electron microscopy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference34 articles.
1. Interface reaction between copper and molten tin–lead solders
2. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
3. Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
4. Pb-free solders for flip-chip interconnects
5. Interfacial reactions between lead-free solders and common base materials
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