Effects of aging on structural evolution of the rapidly solidified Sn–Ag–Zn eutectic solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference21 articles.
1. Lead-free Solders in Microelectronics
2. Room-temperature indentation creep of lead-free Sn–Bi solder alloys
3. Comparison of interfacial reactions of Ni and Ni–P in extended contact with liquid Sn–Bi-based solders
4. Abnormal polarity effect of electromigration on intermetallic compound formation in Sn–9Zn solder interconnect
5. Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder
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1. Study of the Structure and Properties of Rapidly Solidified Tin–Zinc Eutectic Alloys Doped with Antimony;Inorganic Materials: Applied Research;2023-02
2. Dual-cluster model of Sn-based binary eutectics and solders;Materials Today Communications;2022-03
3. Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating;Journal of Materials Research and Technology;2022-03
4. Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints;Soldering & Surface Mount Technology;2021-07-28
5. Influence of aging on microstructure and hardness of lead-free solder alloys;Soldering & Surface Mount Technology;2020-07-08
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