Comparison of intermetallic compound growth and tensile behavior of Sn-3.0Ag-0.5Cu/Cu solder joints by conventional and microwave hybrid heating
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference39 articles.
1. Effect of melting temperature on wettability of Sn-Ag-Cu alloys on Cu Substrate;Erer;Politeknik Dergisi,2018
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3. Influence of Ag-modified graphene nanosheets addition into Sn–Ag–Cu solders on the formation and growth of intermetallic compound layers;Jing;J Alloys Compd,2017
4. Impact strength of Sn–3.0 Ag–0.5 Cu solder bumps during isothermal aging;Wang;Microelectron Reliab,2014
5. Interfacial reaction and shear strength of SnAgCu–xNi/Ni solder joints during aging at 150 C;Yao;Microelectron Eng,2009
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