Vacuum sealing of microcavities using metal evaporation-Reference-Cited by-同舟云学术

Vacuum sealing of microcavities using metal evaporation

Published:1997-06 Issue:1-3 Volume:61 Page:364-368
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Bartek M.,Foerster J.A.,Wolffenbuttel R.F.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Three-dimensional micromachining of silicon pressure sensor integrating resonant strain gauge on diaphragm;Ikeda;Sensors and Actuators,1990

2. The application of time-grained, tensile polysilicon to mechanically resonant transducers;Guckel;Sensors and Actuators,1990

3. Electrostatically driven vacuum-encapsulated polysilicon resonators. Part I. Design and fabrication;Legtenberg;Sensors and Actuators A,1994

4. Permeable polysilicon etch-access windows for microshell fabrication;Lebouitz,1995

5. Field emitter tips for vacuum microelectronic devices;Chin;J. Vac. Sci. Technol.,1990

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