Author:
Su Yu-Chuan,Kim Jongbaeg,Cheng Yu-Ting,Chiao Mu,Lin Liwei
Publisher
Springer Berlin Heidelberg
Reference152 articles.
1. M. Matsuo, N. Hayasaka, K. Okumura, E. Hosomi, C. Takubo: Silicon interposer technology for high-density package. In: Proc. IEEE Electron. Compon. Technol. Conf. (2000) pp. 1455–1459
2. K.E. Peterson: Silicon as a mechanical material, Proc. IEEE 70, 420–457 (1982)
3. L. Lin, H.-C. Chu, Y.-W. Lu: A simulation program for the sensitivity and linearity of piezoresistive pressure sensors, IEEE/ASME J. Microelectromech. Syst. 8, 514–522 (1999)
4. Y.C. Tai, R.S. Muller: Lightly-doped polysilicon bridge as a flow meter, Sens. Actuators 15, 63–75 (1988)
5. D. Hicks, S.-C. Chang, M.W. Putty, D.S. Eddy: Piezoelectrically activated resonant bridge microacceleromenter. In: Tech. Digest Solid-State Sens. Actuators Workshop (1994) pp. 225–228
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