1. A. Partridge, M. Lutz, B. Kim, M. Hopcroft, R.N. Candler, T.W. Kenny, et al., MEMS resonators: getting the packaging right, in: SEMICON-Japan, 2005.
2. Planar processed polysilicon sealed cavities for pressure transducer arrays;Guckel;Proc. Int. Electron Devices Meet.,1984
3. Three-dimensional micromachining of silicon pressure sensor integrating resonant strain gauge on diaphragm;Ikeda;Sens. Actuators A,1990
4. Silicon pressure sensor integrates resonant strain gauge on diaphragm;Ikeda;Sens. Actuators A,1990
5. The application of fine-grained, tensile polysilicon to mechanically resonant transducers;Guckel;Sens. Actuators A,1990