Author:
Chow E.M,Soh H.T,Lee H.C,Adams J.D,Minne S.C,Yaralioglu G,Atalar A,Quate C.F,Kenny T.W
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference27 articles.
1. Forming electrical interconnections through semiconductor wafers;Anthony;J. Appl. Phys.,1981
2. Ultra-low resistance, through-wafer via (TWV) technology and its applications in three dimensional structures in silicon;Soh,1998
3. Fabrication technology for wafer through-hole interconnections and three-dimensional stack of chips and wafers;Linder,1994
4. Stacking technology for a space constrained microsystem;Heschel;J. Intell. Mater. Syst. Struct.,1998
5. Wafer through-hole interconnections with high vertical wiring densities;Christensen;IEEE Trans. Compon., Packag., Manuf. Technol., Part A,1996
Cited by
28 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献