Stacking Technology for a Space Constrained Microsystem
Author:
Affiliation:
1. Mikroelektronik Centret, DTU Bldg. 345-East, DK-2800 Lyngby, Denmark
2. DELTA Danish Electronics Light and Acoustics, DK-2970 Hoersholm, Denmark
Abstract
Publisher
SAGE Publications
Subject
Mechanical Engineering,General Materials Science
Link
http://journals.sagepub.com/doi/pdf/10.1177/1045389X9800900907
Reference14 articles.
1. Wafer through-hole interconnections with high vertical wiring densities
2. Hannemann, R. F. , A. D. Kraus, and M. Pecht. 1994. "Physical Architecture of VLSI Systems," John Wiley & Sons, 503-507.
3. Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon
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