Conformal coating by photoresist of sharp corners of anisotropically etched through-holes in silicon

Author:

Heschel Matthias,Bouwstra Siebe

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Chip stacks for memory applications;Under,1996

2. Stacked multi-chip-module technology for high performance intelligent transducers;Bouwstra;SPIE,1996

3. Photolithography on micro-machined 3D surfaces using electrodeposited photoresists;Kersten;Sensors and Actuators A,1995

4. Wafer through-hole interconnections with high vertical wiring densities, IEEE Trans. Components, Packaging, Manufacturing;Christensen;Technol. A,1996

5. Photolithography in anisotropically etched grooves;Linder,1996

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