Author:
Lee Thomas M.H,Lee Debbie H.Y,Liaw Connie Y.N,Lao Alex I.K,Hsing I-Ming
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Wafer-to wafer bonding for microstructure formation;Schmidt;Proc. IEEE,1998
2. Characterization of the electrostatic bonding of silicon and pyrex glass;Cozma;J. Micromech. Microeng.,1995
3. Anodic bonding of silicon to silicon wafers coated with aluminium, silicon oxide, polysilicon or silicon nitride;Nese;Sens. Actuators, A,1993
4. Experimental evaluation of anodic bonding process based on the Taguchi analysis of interfacial fracture toughness;Go;Sens. Actuators, A,1999
5. Low-temperature bonding of silicon and silicon dioxide by the surface activation method;Takagi;Sens. Actuators, A,1998
Cited by
82 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献