Author:
Go Jeung Sang,Cho Young-Ho
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. K.B. Albaugh, P.E. Cade, Mechanisms of anodic bonding of silicon to pyrex, Tech. Dig., Solid-State Sensor and Actuator Workshop (1988), pp. 109–110.
2. Dielectric isolation of silicon by anodic bonding;Anthony;J. Appl. Phys.,1985
3. S.A. Audet, K.M. Edenfeld, Integrated sensor wafer-level packaging, Int. Con. on Solid-State Sensors and Actuators, Chicago, USA (1997), pp. 287–289.
4. Vacuum packaging for microsensors by glass–silicon anodic bonding;Henmi;Sensors and Actuators,1994
5. M. Esashi, N. Ura, Y. Matsumoto, Anodic bonding for integrated capacitive sensors, Proc. IEEE Workshop on Micro Electro Mechanical Systems, Travemünde, Germany (1992), pp. 43–48.
Cited by
29 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献