1. Anisotropic etching of crystalline silicon in alkaline solutions;Seidel;J. Electrochem. Soc.,1990
2. H. Seidel, The mechanism of anisotropic silicon etching and its relevance for micromachining, Technical Digest of Transducers’87, Tokyo, Japan, June 1987, pp. 120–125.
3. Hydration model for the molarity dependence of the etch rate of Si in aqueous alkali hydroxides;Glembocki;J. Electrochem. Soc.,1991
4. Etching roughness for (1 0 0) silicon surface in aqueous KOH;Palik;J. Appl. Phys.,1991
5. L.D. Clark, Jr., D.J. Edell, KOH:H2O etching of (110) Si, (111) Si, SiO2, and Ta: an experimental study, in: Proceedings of the IEEE Micro-Robots and Teleoperators Workshop, Hyannis, Massachusetts, November 1987.