Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module-Reference-Cited by-同舟云学术

Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

Published:2019-05 Issue: Volume:10 Page:73-81
ISSN:2451-9049
Container-title:Thermal Science and Engineering Progress
language:en
Short-container-title:Thermal Science and Engineering Progress

Author:

Chen Yiyi,Li Bo^ORCID,Wang Xin,Yan Yuying,Wang Yangang,Qi Fang

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes

Reference34 articles.

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3. Liquid cooled cold plates for industrial high-power electronic devices—Thermal design and manufacturing considerations;Kandlikar;Heat Transfer Eng.,2009

4. Two-phase liquid cooling for thermal management of IGBT power electronic module;Wang;J. Electron. Packag.,2013

5. Effects of particles deposition on thermal performance of a convective-radiative heat sink porous fin of an electronic component;Oguntala;Thermal Sci. Eng. Progress,2018

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