Liquid Cooled Cold Plates for Industrial High-Power Electronic Devices—Thermal Design and Manufacturing Considerations
Author:
Publisher
Informa UK Limited
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Link
http://www.tandfonline.com/doi/pdf/10.1080/01457630902837343
Reference44 articles.
1. A Conduction-Cooled Module for High-Performance LSI Devices
2. Conduction Cooling for an LSI Package: A One-Dimensional Approach
3. VLSI Packaging Technique Using Liquid-Cooled Channels
4. Thermal management of electronics: A review of literature
5. The Design of Cold Plates for the Thermal Management of Electronic Equipment
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