Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison-Reference-Cited by-同舟云学术

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Direct Metallization-Based DBC-Free Power Modules for Near-Junction Water Cooling: Analysis and Experimental Comparison

Published:2024-06 Issue:6 Volume:39 Page:7052-7063
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Wang Liang¹^ORCID,Gong Jiakun¹^ORCID,Long Teng²^ORCID,Blaabjerg Frede³^ORCID,Hu Borong²^ORCID,Wang Yulei¹^ORCID,Zeng Zheng¹^ORCID

Affiliation:

1. State Key Laboratory of Power Transmission Equipment Technology, School of Electrical Engineering, Chongqing University, Chongqing, China

2. Electrical Engineering Division, Department of Engineering, University of Cambridge, Cambridge, U.K.

3. Department of Energy Technology, Aalborg University, Aalborg, Denmark

Funder

National Natural Science Foundation of China

Chongqing Research Program of Basic Research and Frontier Technology

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/63/10505873/10444073.pdf?arnumber=10444073

Reference31 articles.

1. Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module

2. Direct Phase-Change Cooling of Vapor Chamber Integrated With IGBT Power Electronic Module for Automotive Application

3. Automated Heatsink Optimization for Air-Cooled Power Semiconductor Modules

4. Air-Cooling System Optimization for IGBT Modules in MMC Using Embedded O-Shaped Heat Pipes

5. A New Package for SiC Power Modules with Ceramic Heatsink

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