Three-dimensional integration of MEMS

Author:

Theuss Horst,Pressel Klaus

Publisher

Elsevier

Reference24 articles.

1. Packaging for MEMS and sensors – challenges and opportunities;Theuss;ECS Trans.,2012

2. D. Saint-Patrice, J.L. Pornin, B. Savornin, G. Rodriguez, S. Danthon, S. Fanget, Low temperature sealing process for vacuum MEMS encapsulation, in: 62th Electronic Components & Technology Conference 2012, May 29–June 01, San Diego, CA, p. 97.

3. Z. Cao, D. Aslam, Thin film packaging process for MEMS device using polycrystalline diamond, in: Engineered and Molecular Systems (NEMS), 20–23 Jan. 2010, pp. 802–805.

4. Thin film encapsulation technology for harms using sacrificial CF-polymer;Reuter;Sens. Actuators,2008

5. M. Franosch, K.-G. Oppermann, A. Meckes, W. Nessler, R. Aigner, Wafer-level-package for Bulk Acoustic Wave (BAW) filters, in: IEEE MTT-S International Microwave Symposium Digest, June 2004, vol. 2, p. 493.

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