Packaging for MEMS and Sensors - Challenges and Opportunities

Author:

Theuss Horst

Abstract

The wide field of MEMS and Sensor technologies adds numerous aspects to the classical world of semiconductor industry. MEMS-specific requirements impact wafer technologies, assembly and electrical interconnection both on package and system level. Reliability engineers have to cope with materials, which are new to semiconductor environments. Furthermore, degree and level of integration, as well supply chains might have to be reviewed. This paper elaborates on novel flavors which the MEMS- and Sensor features add to the semiconductor industry. A focus is put onto the field of packaging. Striving for low stress packages is the traditional field of sensor packaging development, because package-induced mechanical stress typically deteriorates the performance of a sensor. On the other hand, specific case studies demonstrate, how packaging can as well substantially contribute to the performance of a sensor device.

Publisher

The Electrochemical Society

Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Three-dimensional integration of MEMS;Handbook of Silicon Based MEMS Materials and Technologies;2020

2. 3D Integration of MEMS;Handbook of Silicon Based MEMS Materials and Technologies;2015

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