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Laser printing of flip-chip interconnects for high frequency applications

  • Published:2018-04 Issue: Volume:32 Page:110-115
  • ISSN:1526-6125
  • Container-title:Journal of Manufacturing Processes
  • language:en
  • Short-container-title:Journal of Manufacturing Processes

Author:

Charipar Kristin M.,Charipar Nicholas A.,Prestigiacomo Joseph C.,Bingham Nicholas S.,Piqué Alberto

Funder

U.S. Naval Research Laboratory

Office of Naval Research

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference16 articles.

1. Integrating MEMs and ICs;Fischer;Microsys Nanoeng,2015

2. Review of packaging of optoelectronic, photonic, and MEMS components;Tekin;IEEE J Sel Top Quant Electr,2011

3. Pb-free solders for flip-chip interconnects;Frear;JOM,2001

4. Direct-write technologies for rapid prototyping applications;Piqué,2002

5. Three-dimensional printing of interconnects by laser direct-write of silver nanopaste;Wang;Adv Mat,2010

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