Integrating MEMS and ICs

Author:

Fischer Andreas C.,Forsberg Fredrik,Lapisa Martin,Bleiker Simon J.,Stemme Göran,Roxhed Niclas,Niklaus Frank

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Materials Science (miscellaneous),Atomic and Molecular Physics, and Optics

Reference167 articles.

1. ITRS. International Technology Roadmap for Semiconductors, 2011 Edition. The International Technology Roadmap, 2011; http://www.itrs.net/reports.html .

2. Tummala RR . SOP: What is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade. IEEE Transactions on Advanced Packaging 2004; 27: 241–249.

3. Davis WR, Wilson J, Mick S et al. Demystifying 3D ICs: The pros and cons of going vertical. IEEE Design & Test of Computers 2005; 22: 498–510.

4. Yole Développement. Status of the MEMS Industry in 2014. Yole Développement, Villeurbanne, France, 2014; http://www.i-micronews.com/mems-sensors-report/product/status-of-the-mems-industry-2014.html .

5. Jérémie Bouchaud . MEMS Market Tracker – Q4 2014. IHS Technology, Englewood, CO 80112, USA, 2015; https://technology.ihs.com/490495/mems-market-tracker-q4-2014 .

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