Funder
National Natural Science Foundation of China
Natural Science Foundation of Shandong Province
Subject
General Engineering,Condensed Matter Physics
Reference51 articles.
1. Cramming More components onto integrated circuits;Moore;Proc. IEEE,1998
2. Cooling a microprocessor chip;Mahajan;Proc. IEEE,2006
3. Scaling with design constraints: predicting the future of big chips;Huang;IEEE Micro,2011
4. Integrating MEMS and ICs;Fischer;Microsystems & Nanoengineering,2015
5. A review of 3-D packaging technology;Al-Sarawi;IEEE Trans. Compon. Packag. Manuf. Technol. Part B-Advanced Packaging,1998