Funder
National Natural Science Foundation of China
Natural Science Foundation of Shandong Province
Reference51 articles.
1. Cramming More components onto integrated circuits;Moore;Proc. IEEE,1998
2. Cooling a microprocessor chip;Mahajan;Proc. IEEE,2006
3. Scaling with design constraints: predicting the future of big chips;Huang;IEEE Micro,2011
4. Integrating MEMS and ICs;Fischer;Microsystems & Nanoengineering,2015
5. A review of 3-D packaging technology;Al-Sarawi;IEEE Trans. Compon. Packag. Manuf. Technol. Part B-Advanced Packaging,1998
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献