Improving the high-frequency performance of SiGe HBTs by a global additional uniaxial stress

Author:

Viet Dinh Thanh,Hong Sung-Min,Jungemann Christoph

Publisher

Elsevier BV

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Reference46 articles.

1. SiGe HBT technology: a new contender for Si-based RF and microwave circuit applications;Cressler;IEEE Trans Microwave Theory Tech,1998

2. Silicon–germanium heterojunction bipolar transistors;Cressler,2003

3. Silicon heterostructure handbook: materials, fabrication, devices, circuits, and applications of SiGe and Si strained-layer epitaxy,2006

4. Khater M, Rieh J-S, Adam T, Chinthakindi A, Johnson J, Krishnasamy R, et al. SiGe HBT technology with fmax/fT=350/300GHz and gate delay below 3.3ps. In: IEEE Tech Dig IEDM; 2004. p. 247–50.

5. Scaling of SiGe heterojunction bipolar transistors;Rieh;Proc IEEE,2005

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1. Microscopic Simulation of the RF Performance of SiGe HBTs With Additional Uniaxial Mechanical Stress;IEEE Transactions on Electron Devices;2022-09

2. Effect of uniaxial strain on characteristic frequency of scaled SiGe HBT with embedded stress raiser;Journal of Computational Electronics;2022-07-16

3. Design and Simulation of Strained Si/SiGe HBT Architecture with Uniaxially-stressed Collector;2021 International Symposium on Devices, Circuits and Systems (ISDCS);2021-03-03

4. Performance Enhancement in Bipolar Junction Transistors Using Uniaxial Stress on (100) Silicon;IEEE Transactions on Electron Devices;2016-07

5. A 1D numerical model for rapid stress analysis in bipolar junction transistors;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2016-05-27

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