Author:
Mitic G.,Beinert R.,Klofac P.,Schultz H.J.,Lefranc G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. K. H. Sommer et al.: “Multichip high-power IGBT modules for traction and industrial applications”, Proc. EPE97
2. Insulation voltage test and partial discharge test of 3.3 kV IGBT modules;Göttert,1997
3. Int. Elect. Commission: “Electronic power converters”, IEC 1287
4. On the effect of power cycling stress on IGBT modules;Cova;Microelectronics Reliability,1998
5. Advanced IGBT modules for railway traction applications: Reliability testing;Berg;Microelectronics Reliability,1998
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