Author:
Schuler Louis,Chamoin Ludovic,Khatir Zoubir,Berkani Mounira,Ouhab Merouane,Degrenne Nicolas
Publisher
Springer Science and Business Media LLC
Subject
Applied Mathematics,Computational Mathematics,Computational Theory and Mathematics,Mechanical Engineering,Ocean Engineering,Computational Mechanics
Reference38 articles.
1. Deplanque S, Nuchter W, Wunderle B, Schacht R, Michel B (2006) Lifetime prediction of snpb and snagcu solder joints of chips on copper substrate based on crack propagation fe-analysis. In: EuroSime 2006-7th international conference on thermal, mechanical and multiphysics simulation and experiments in micro-electronics and micro-systems. IEEE, pp 1–8
2. Bayerer R, Herrmann T, Licht T, Lutz J, Feller M (2008) Model for power cycling lifetime of igbt modules—various factors influencing lifetime. In: 5th international conference on integrated power electronics systems, pp 1–6
3. Smet V, Forest F, Huselstein J, Richardeau F, Khatir Z, Lefebvre S, Berkani M (2011) Ageing and failure modes of igbt modules in high-temperature power cycling. IEEE Trans Ind Electron 58(10):4931–4941. https://doi.org/10.1109/TIE.2011.2114313
4. Kovacevic-Badstuebner IF, Kolar JW, Schilling U, Chung H, Wang H, Blaabjerg F, Pecht M (2015) Modelling for the lifetime prediction of power semiconductor modules. IET Publishing, London, pp 103–140
5. Sasaki K, Iwasa N, Kurosu T, Saito K, Koike Y, Kamita Y, Toyoda Y (2008) Thermal and structural simulation techniques for estimating fatigue life of an igbt module. In: 2008 20th international symposium on power semiconductor devices and IC’s, pp 181–184