Research on the Effects of Solder Layer THICKNESS on the Reliability of High Power IGBT Module-Reference-Cited by-同舟云学术

Research on the Effects of Solder Layer THICKNESS on the Reliability of High Power IGBT Module

Published:2023-05-12 Issue: Volume: Page:
ISSN:
Container-title:2023 6th International Conference on Electronics Technology (ICET)
language:
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Author:

Wu Lei¹,Yang Yuan²,Yang Xiaofei³,Ma Haohao²,Gong Hao³,Hou Shuyue³

Affiliation:

1. Xi’an University of Technology,CRRC Yongji Electric CO., LTD.,Xi’an,China

2. Xi’an University of Technology,Xi’an,China

3. CRRC Yongji Electric CO., LTD.,Xi’an,China

Funder

National Natural Science Foundation of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10210847/10211258/10211457.pdf?arnumber=10211457

Reference17 articles.

1. Study on health status of IGBT solder layer based on electrical-thermal-mechanical stress multiphysics[J];chen;Transactions of China Electrotechnical Society,2015

2. Study on the Thermal Dependence of SMD Solder Layer Thickness on Power Component [J];lei;Semiconductor technology,2007

3. Influence of voids in IGBT solder layer on thermal reliability of devices[J];jian;Silicon Electronics,2011

4. Thermal fatigue life time prediction of Sn3.5Ag lead-free solder joint for chip scale package[J];han;Chinese Journal of Semiconductors,2006

5. Thermal analysis of IGBT module and improvement of thermal network model of wind power converter affected by solder layer fatigue[J];hui;Transactions of China Electrotechnical Society,2017

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