Wafer level packaging having bump-on-polymer structure

Author:

Reche John J.H.,Kim Deok-Hoon

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference67 articles.

1. Elenius P, Barrett S, Kim D-H. Wafer level packaging. In: APACK 2001, An International Conference on Advances in Packaging, Singapore, 5–7 December 2001

2. Elenius P. The Ultra CSP wafer level package. In: 4th Pan Pacific Microelectronics Symposium, February 1999

3. Yang H, Elenius P, Barrett S, Schneider C, Leal J, Moraca R, et al. Reliability characterization in ultra CSP package development. In: IEEE 50th ECTC, Las Vegas, Nevada, 21–24 May 2000

4. Reche JJH. High density multichip interconnect and packaging technology. In: IEEE IEMT Workshop on Multichip Interconnection, Orlando, FL, 10–13 October 1988

5. Solder joint reliability of a polymer reinforced wafer level package;Kim;Microelectron. Reliab.,2002

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