Author:
Kim Deok-Hoon,Elenius Peter,Johnson Michael,Barrett Scott
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Elenius P, Barrett S, Kim D-H. Wafer level packaging. APACK 2001, An International Conference on Advances in Packaging, Singapore, 5–7 December 2001
2. Elenius P. The Ultra CSP wafer level package. 4th Pan Pacific Microelectronics Symposium, February 1999
3. Yang H, Elenius P, Barrett S, Schneider C, Leal J, Moraca R, et al. Reliability characterization in Ultra CSP Package Development. IEEE 50th ECTC, Las Vegas, Nevada, 21–24 May 2000
4. Kim D-H, Elenius P Johnson M, Barrett S. Solder joint reliability of a polymer reinforced wafer level package. IEEE 52nd ECTC 2002, San Diego, California, 28–31 May 2002
5. Kim D-H, Elenius P, Barrett S. A polymer reinforced WLP/Why it has superior solder joint reliability. IMAPS 2001, The 34th International Symposium on Microelectronics, Baltimore, MA, 9–11 October 2001
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