Optimum Rc Control and Productivity Boost in Wafer-Level Packaging Enabled by High- Throughput UBM/RDL Technology
Author:
Affiliation:
1. Evatec AG,Trübbach,Switzerland
2. Evatec AG, Taiwan Branch,Zhubei City,Taiwan (R.O.C.)
3. Fraunhofer IZM-ASSID,Moritzburg,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195698.pdf?arnumber=10195698
Reference11 articles.
1. UBM/RDL Deposition by PVD for FOWLP in High Volume Production
2. Impact of Process Control on UBM/RDL Contact Resistance for Next-Generation Fan-Out Devices
3. Evaluation of ICP Sputter Etch with Reducing Atmosphere for the Improvement of Rc in UBM/RDL Applications
4. High-performance integrated fan-out wafer level packaging (InFO-WLP): Technology and system integration
5. InFO (Wafer Level Integrated Fan-Out) Technology;tseng;2016 IEEE 66th Electronic Components and Technology Conference (ECTC) ECTC,2016
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