Reliability characterization in Ultra CSP/sup TM/ package development-Reference-Cited by-同舟云学术

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Reliability characterization in Ultra CSP/sup TM/ package development

Published: Issue: Volume: Page:
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Container-title:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
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Author:

Yang H.,Elenius P.,Barrett S.,Schneider C.,Leal J.,Moraca R.,Moody R.,Young-Do Kweon ,Deok Hoon Kim ,Patterson D.,Goodman T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6887/18541/00853389.pdf?arnumber=853389

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wafer level packaging having bump-on-polymer structure;Microelectronics Reliability;2003-06

2. Solder joint reliability of a polymer reinforced wafer level package;Microelectronics Reliability;2002-12

3. 3D structure design and reliability analysis of wafer level package with bubble-like stress buffer layer;The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543)

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