The dependence of deposition rate on power input for dc and rf magnetron sputtering-Reference-Cited by-同舟云学术

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The dependence of deposition rate on power input for dc and rf magnetron sputtering

Published:1981-01 Issue:7 Volume:31 Page:315-317
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Nyaiesh AR,Holland L

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference4 articles.

1. Proc. 8th Internat. Vacuum Congress. Thin Films, Cannes;Samuel,1980

2. Discharge characteristics for magnetron sputtering of Al in Ar and Ar/O2 mixtures

3. Seminar, Film preparation and etching by plasma technology;Holland,1981

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