Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling-Reference-Cited by-同舟云学术

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Working mechanism of iodide ions and its application to Cu microstructure control in through silicon via filling

Published:2019-02 Issue: Volume:295 Page:224-229
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Sung MinJae,Kim Sang-Hyeok,Lee Hyo-Jong,Lim Taeho,Kim Jae Jeong

Funder

National Research Foundation of Korea

Korea government

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference31 articles.

1. Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias;Inoue;Electrochim. Acta,2013

2. Texture and grain size investigation in the copper plated through-silicon via for three-dimensional chip stacking using electron backscattering diffraction;Kadota;Electrochem. Solid State Lett.,2011

3. Bottom-up filling of through silicon vias using galvanostatic Cu electrodeposition with the modified organic additives;Kim;J. Electrochem. Soc.,2015

4. Galvanostatic bottom-up filling of TSV-like trenches: choline-based leveler containing two quaternary ammoniums;Kim;Electrochim. Acta,2015

5. Extreme bottom-up superfilling of through-silicon-vias by damascene processing: suppressor disruption, positive feedback and turing patterns;Moffat;J. Electrochem. Soc.,2012

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1. Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition;Electrochimica Acta;2024-11

2. Cu microvia filling by pulse-reverse electrodeposition with a single accelerator;Electrochimica Acta;2024-06

3. Synergistic Effect of Cta+ and Br- on Defect-Free Tsv Filling by Cu Electrodeposition;2024

4. Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating;The Journal of Physical Chemistry C;2023-01-11

5. Evaluating the via filling performance with thin surface Cu by the synergistic effect of different additives;Thin Solid Films;2022-09

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