Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole-Reference-Cited by-同舟云学术

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Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole

Published:2018-09 Issue: Volume:283 Page:560-567
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Zheng Li,He Wei,Zhu Kai,Wang Chong,Wang Shouxu,Hong Yan,Chen Yuanming,Zhou Guoyun,Miao Hua,Zhou Jinqun

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference37 articles.

1. A synergy effect of 2-MBT and PE-3650 on the bottom-up filling in electroless copper plating;Zan;Electrochem. Solid State Lett.,2011

2. Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating;Dixit;J. Electrochem. Soc.,2006

3. Plating uniformity of bottom-up copper pillars and patterns for IC substrates with additive-assisted electrodeposition;Chen;Electrochim. Acta,2014

4. Enhanced electrodeposition of Cu into recessed features via topographically selective ozonolysis of adsorbed accelerator;Mazur;J. Electrochem. Soc.,2008

5. Damascene copper electroplating for chip interconnections;Andricacos;IBM J. Res. Dev.,1998

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1. Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy;Electrochimica Acta;2024-11

2. Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating;Surfaces and Interfaces;2024-10

3. Influence Mechanism of Synergistic Additives on the Nucleation and Coating Morphology and Structure of Copper Electronic Plating;CHEM J CHINESE U;2024

4. 1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-08

5. Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating;Journal of Electroanalytical Chemistry;2024-07

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