Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating-Reference-Cited by-同舟云学术

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Tributyl(hexyl)phosphonium chloride as a new leveler for microvia copper superconformal electronic plating

Published:2024-07 Issue: Volume:964 Page:118340
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Song Tao,Wang Zhao-Yun,Yang Jia-Qiang,Zhao Yi,Yang Fang-Zu^ORCID,Zhan Dongping^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference41 articles.

1. Effect of reverse pulse on copper fill;Hayase;J. Electrochem. Soc.,2009

2. Bottom-up copper filling of large scale through silicon vias for MEMS technology;Menk;J. Electrochem. Soc.,2018

3. Review-management of copper damascene plating;Carpio;J. Electrochem. Soc.,2018

4. Quinacridone skeleton as a promising efficient leveler for smooth and conformal copper electrodeposition;Wang;Dyes Pigm.,2020

5. A model for copper deposition in the damascene process;Gabrielli;Electrochim. Acta,2006

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition;Electrochimica Acta;2024-11

2. Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy;Electrochimica Acta;2024-11

3. Synergistic Effect of Cta+ and Br- on Defect-Free Tsv Filling by Cu Electrodeposition;2024

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