Author:
Wang An-yin,Chen Biao,Fang Lei,Yu Jian-jun,Wang Li-min
Subject
Electrochemistry,General Chemical Engineering
Reference34 articles.
1. Electroplating of copper in the presence of 5,6-Dihydropyrimidine-2-(1H)-thione, 2-Methylthiopyrimidine-4-(1H)-one, 2-Thiopyrimidine-4-(1H)-ones, and 2,4-Pyrimidine(1H,3H) -dione derivatives as organic additives;Ahmed;Journal of Dispersion Science and Technology,2011
2. Influence of additives on Cu electrodeposition mechanisms in acid solution: direct current study supported by non-electrochemical measurements;Bonou;Electrochimica Acta,2002
3. Influence of aromatic functionality on quaternary ammonium levelers for Cu plating;Hatch;Journal of the Electrochemical Society,2011
4. The chemistry of additives in damascene copper plating;Vereecken;IBM Journal of Research and Development,2005
5. H.G. Creutz, U.S. Patent 3,770,598 (1973).
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