The chemistry of additives in damascene copper plating-Reference-Cited by-同舟云学术

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The chemistry of additives in damascene copper plating

Published:2005-01 Issue:1 Volume:49 Page:3-18
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Vereecken P. M.,Binstead R. A.,Deligianni H.,Andricacos P. C.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5388850/05388860.pdf?arnumber=5388860

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