Evaluating Copper Plating Process for Filling Micro Vias with Thin Surface Cu by the 1-(4-Carboxyphenyl)-5-Mercapto-1h-Tetrazole Additive-Reference-Cited by-同舟云学术

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Evaluating Copper Plating Process for Filling Micro Vias with Thin Surface Cu by the 1-(4-Carboxyphenyl)-5-Mercapto-1h-Tetrazole Additive

Published:2024 Issue: Volume: Page:
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Author:

Lin Zewei,Tao Xuefei,Tengxu Lingjie,Tao Zhihua

Publisher

Elsevier BV

Reference37 articles.

1. The effect of tricyclazole as a novel leveler for filling electroplated copper microvias;C Liao;Journal of Electroanalytical Chemistry,2018

2. Performance analysis of cylindrical through silicon via with interfacial crack;Kumari;2023 24th International Symposium on Quality Electronic Design (ISQED),2023

3. Microvia filling by copper electroplating using diazine black as a leveler[J];W P Dow;Electrochimica Acta,2009

4. Electroanalytical study of organic additive interactions in copper plating and their correlation with via fill behavior;T B Huang;Journal of Electronic Materials,2018

5. Improving accuracy of filling performance prediction in microvia copper electroplating;J H Moon;Journal of Electroanalytical Chemistry,2020

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