Microvia filling by copper electroplating using diazine black as a leveler
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference58 articles.
1. Development of sequential build-up multilayer printed wiring boards in Japan
2. Next-Generation Microvia and Global Wiring Technologies for SOP
3. Damascene copper electroplating for chip interconnections
4. Leveling of 200 nm Features by Organic Additives
5. Electrochemical and Fill Studies of a Multicomponent Additive Package for Copper Deposition
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