The effect of tricyclazole as a novel leveler for filling electroplated copper microvias-Reference-Cited by-同舟云学术

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The effect of tricyclazole as a novel leveler for filling electroplated copper microvias

Published:2018-10 Issue: Volume:827 Page:151-159
ISSN:1572-6657
Container-title:Journal of Electroanalytical Chemistry
language:en
Short-container-title:Journal of Electroanalytical Chemistry

Author:

Liao Chaohui,Zhang Shengtao^ORCID,Chen Shijin,Qiang Yujie,Liu Gen,Tang Mingxing,Tan Bochuan,Fu Denglin,Xu Yue

Funder

Sail plane

Chongqing Innovation Fund for Graduate Students

National Natural Science Foundation of China

Opening Project of Material Corrosion and Protection Key Laboratory of Sichuan Province

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering,Analytical Chemistry

Reference54 articles.

1. A synergy effect of 2-MBT and PE-3650 on the bottom-up filling in electroless copper plating;Zan;Electrochem. Solid-State Lett.,2011

2. Effects of voiding on thermomechanical reliability of copper-filled microvias: modeling and simulation;Ning;IEEE Trans. Device Mater. Reliab.,2015

3. Optimization of the copper plating process using the Taguchi experimental design method;Dow;J. Electrochem. Soc.,2015

4. Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method;Ren;Trans. Inst. Met. Finish.,2015

5. A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode;Lu;J. Electroanal. Chem.,2014

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