Metal seed layer sputtering on high aspect ratio through-silicon-vias for copper filling electroplating
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference20 articles.
1. Bottom-up copper electroplating using transfer wafers for fabrication of high aspect-ratio through-silicon-vias;Song;Microelectron. Eng.,2010
2. Investigation of different methods for isolation in through silicon via for 3D integration;Sage;Microelectron. Eng.,2013
3. Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology;Diehl;Microelectron. Eng.,2012
4. High aspect ratio via etch development for Cu nails in 3-D-stacked ICs;Van Aelst;Thin Solid Films,2008
5. High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed;Druais;Microelectron. Eng.,2008
Cited by 10 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy;Dyes and Pigments;2024-08
2. Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application;Journal of Manufacturing Processes;2024-07
3. Effect of sputtering process parameters on the uniformity of copper film deposited in micro-via;Journal of Materials Research and Technology;2023-07
4. A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening;Journal of Electroanalytical Chemistry;2023-05
5. A novel evaluation method for thin films mechanical characterizations using cutting system;Current Applied Physics;2021-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3