Studies of polixetonium chloride as a novel, hypotoxic and single additive of copper electronic plating for microvia void-free filling in printed circuit board application

Author:

Wang Zhao-Yun,Yu Daquan,Jin Lei,Yang Jia-Qiang,Zhan DongPing,Yang Fang-Zu,Sun Shi-Gang

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference52 articles.

1. Electromigration in three-dimensional integrated circuits;Shen;Appl Phys Rev,2023

2. Next-generation high-density PCB development by fan-out RDL technology;Shih;IEEE Trans Device Mater Reliab,2022

3. Ieee, accessing on-chip instruments through the life-time of systems;Larsson,2016

4. Damascene copper electroplating for chip interconnections;Andricacos;IBM J Res Dev,1998

5. Research progress of copper electrodeposition filling mechanism in silicon vias;Sun;J Electrochem,2022

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