Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology-Reference-Cited by-同舟云学术

Formation of electroless barrier and seed layers in a high aspect ratio through-Si vias using Au nanoparticle catalyst for all-wet Cu filling technology

Published:2011-07 Issue:17 Volume:56 Page:6245-6250
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Inoue Fumihiro,Shimizu Tomohiro,Yokoyama Takumi,Miyake Hiroshi,Kondo Kazuo,Saito Takeyasu,Hayashi Taro,Tanaka Shukichi,Terui Toshifumi,Shingubara Shoso

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference31 articles.

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3. RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

4. Interconnects Roadmap;ITRS,2009

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