RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking-Reference-Cited by-同舟云学术

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

Published:2010-03 Issue:3 Volume:87 Page:491-495
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Cadix L.,Bermond C.,Fuchs C.,Farcy A.,Leduc P.,DiCioccio L.,Assous M.,Rousseau M.,Lorut F.,Chapelon L.L.,Flechet B.,Sillon N.,Ancey P.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

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3. K. Fukushima, T. Yamada, Y. Kikuchi, H. Tanaka, T. Koyanagi, in: J.U. ECTC, vol. 57, M. Tohoku, Univ., Sendai, 2007, pp. 836–841.

4. L. Cadix, P. Leduc, A. Farcy, M. Assous, C. Bermond, C. Fuchs, L. Di Cioccio, B. Charlet, A. Roule, M. Rousseau, L.L. Chapelon, B. Flechet, N. Sillon, P. Ancey, Conference Proceedings of AMC 2008, pp. 487–494.

5. B. Aspar, C. Lagahe-Blanchard, H. Moriceau, ECS, vol. 27, 2001.

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