Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application-Reference-Cited by-同舟云学术

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Micro-pattern Corrosion Screening on Bimetallic Corrosion for Microelectronic Application

Published:2016-08 Issue: Volume:210 Page:512-519
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Yu Kyle Kai-Hung,Rimal Sirish,Asokan Muthappan,Nalla Praveen R.,Koskey Simon,Pillai Karthikeyan S.M.,Chyan Oliver,Singh Kanwal Jit,Suri Satyarth

Funder

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

Reference29 articles.

1. Pattern Geometry Effects in the Chemical-Mechanical Polishing of Inlaid Copper Structures;Steigerwald;Journal of Electrochemical Society,1994

2. Microelectronic Applications of Chemical-Mechanical Planarization;Park,2008

3. All-Copper Chip-to-Substrate Interconnects Part I. Fabrication and Characterization;Osborn;Journal of The Electrochemical Society,2008

4. High-Frequency Chip Connections;Spencer;Science,2008

5. Unique Size-Dependent Challenges for BEOL Cleans in the Patterning of Sub-20nm Features;Singh;Solid State Phenomena,2012

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2. Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging;Materials;2023-11-22

3. Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application;MethodsX;2021

4. Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments;Microelectronics Reliability;2020-10

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