Author:
Ross Nick,Asokan Muthappan,Ashok Kumar Goutham Issac,Caperton Joshua,Alptekin John,Salunke Ashish Shivaji,Chyan Oliver M.
Funder
SRC
University of North Texas
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference36 articles.
1. Heterogeneous integration of memory stacks;Lau,2019
2. Advances in wire-bonding technology for 3D die stacking and fan out wafer level package;Qin,2017
3. Copper high volume manufacturing R&D to production;Chylak,2011
4. Wire-bonding using copper wire;Zhong;Microelectron. Int.,2009
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