Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Moisture Content and Early Corrosion Detection of Cu Wire Bonding in a Semiconductor Package

Published:2023-09-27 Issue:6 Volume:23 Page:2362-2369
ISSN:1547-7029
Container-title:Journal of Failure Analysis and Prevention
language:en
Short-container-title:J Fail. Anal. and Preven.

Author:

Supramaniam Saraswathy,Bakar Maria Abu,Atiqah A.,Jalar Azman,Ab. Razak Mohd Zulhakimi

Publisher

Springer Science and Business Media LLC

Subject

Mechanical Engineering,Mechanics of Materials,Safety, Risk, Reliability and Quality,General Materials Science

Link

https://link.springer.com/content/pdf/10.1007/s11668-023-01751-3.pdf

Reference23 articles.

1. N. Ross, M. Asokan, G.I.A. Kumar, J. Caperton, J. Alptekin, A.S. Salunke, O.M. Chyan, Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments. Microelectron. Reliab. 113, 113917 (2020)

2. K. Shinohara, T. Kobayashi and A. Miyota, Effect of Bonding Position between Cu Wire and Al pad in THB Reliability Test, in 2023 International Conference on Electronics Packaging (ICEP, 2023), pp. 83-84.

3. V. Mathew, E. Wikramanayake, and S. F. Chopin, Corrosion of copper wire bonded packages by chlorine containing foreign particles, in 2020 IEEE 70th Electron. Components Technol. Conf. (IEEE, 2020), pp. 504–511.

4. Z. Bachok, A.A. Saad, F.C. Ani, A. Jalar, M.A. Abas, Structural assessment of lead free solder joint of miniaturized electronics assembly. Int. J. Integr. Eng. 10, 26 (2018)

5. N. Jiang, L. Zhang, Z.-Q. Liu, L. Sun, W.-M. Long, P. He, M.-Y. Xiong, M. Zhao, Reliability issues of lead-free solder joints in electronic devices. Sci. Technol. Adv. Mater. 20, 876 (2019)

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3